发明名称 |
MOUNTING APPARATUS FOR ELECTRONIC COMPONENTS AND METHOD OF ASSEMBLY |
摘要 |
A mounting apparatus for electronic components is provided. The mounting apparatus includes a mounting frame including a support portion, backing portion, and lip portion. The backing portion is coupled to a support portion rear end and includes a first segment and a second segment, wherein the second segment is oriented perpendicular to the support portion and the first portion. The lip portion is coupled to a support portion front end such that the support portion and the lip portion define a plurality of slots extending therethrough. The mounting apparatus also includes a plurality of tee bolts each including a first portion and a second portion extending perpendicularly through the first portion, wherein the first portion is removably inserted into a slot. The mounting apparatus also includes a plurality of locating pins that are inserted into a threaded hole extending through the backing portion second segment.
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申请公布号 |
US2009257204(A1) |
申请公布日期 |
2009.10.15 |
申请号 |
US20080241180 |
申请日期 |
2008.09.30 |
申请人 |
MELARAGNO MICHAEL J;JESSEN GLENN A;JOVANOVIC ALEKSANDAR;ROZIC TIMOTHY J;FISHER JR RUSSELL C |
发明人 |
MELARAGNO MICHAEL J.;JESSEN GLENN A.;JOVANOVIC ALEKSANDAR;ROZIC TIMOTHY J.;FISHER, JR. RUSSELL C. |
分类号 |
H05K7/14;B23Q3/18 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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