发明名称 RESIN COMPOSITION FOR SEALING LIGHT-EMITTING DEVICE AND LAMP
摘要 A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, a cationic polymerization initiator and a metal oxide fine particle. Furthermore, a lamp of the present invention includes a package equipped with a sealing member, an electrode exposed in the bottom portion of the sealing member, and a light-emitting device arranged on the bottom portion and electrically connected with the electrode, wherein the light-emitting device is sealed with the resin composition for sealing a light-emitting device filled in the sealing member.
申请公布号 US2009256171(A1) 申请公布日期 2009.10.15
申请号 US20070303347 申请日期 2007.12.26
申请人 SHOWA DENKO K.K. 发明人 TAKEI TOMOYUKI;UCHIDA HIROSHI
分类号 C08L83/06;H01L33/56;H01L33/62 主分类号 C08L83/06
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