| 摘要 |
A method for forming a conductive film, includes: applying a dispersion liquid above a substrate, the dispersion liquid including a plurality of conductive fine-particles made of one conductive material selected from the group consisting of copper, nickel, and an alloy that includes copper or nickel as a main component; and forming the conductive film made from the conductive fine-particles, by heating the dispersion liquid that has been applied above the substrate in an atmosphere including formic acid, by baking the conductive fine-particles so that the conductive fine-particles are mutually fusion bonded.
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