LOWER LINER WITH INTEGRATED FLOW EQUALIZER AND IMPROVED CONDUCTANCE
摘要
A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an uneven etching of the substrate. The integrated flow equalizer is configured to equalize the flow of the processing gases evacuated from the chamber via the lower liner.
申请公布号
WO2009126576(A2)
申请公布日期
2009.10.15
申请号
WO2009US39662
申请日期
2009.04.06
申请人
APPLIED MATERIALS, INC.;CARDUCCI, JAMES, D.;NGUYEN, ANDREW;BALAKRISHNA, AJIT;KUTNEY, MICHAEL, C.
发明人
CARDUCCI, JAMES, D.;NGUYEN, ANDREW;BALAKRISHNA, AJIT;KUTNEY, MICHAEL, C.