发明名称 CLIP-ON LEAD FRAME
摘要 <p>A capacitor with first plates and second plates. A dielectric is between the first plates and the second plates. A first external termination is in electrical contact with the first plates and a second external termination is in electrical contact with the second plates. A first lead terminal is in electrical contact with the first external termination and the first lead terminal has a first foot below the first external termination and a first solder stop coated on the first foot between the first foot and the first external termination. A second lead terminal is in electrical contact with the second external termination wherein the second lead terminal comprises a second foot below the second external termination and a second solder stop is coated on the second foot between the second foot and the second external termination.</p>
申请公布号 WO2009126139(A1) 申请公布日期 2009.10.15
申请号 WO2008US59569 申请日期 2008.04.07
申请人 KEMET ELECTRONICS CORPORATION;TAJUDDIN, AZIZUDDIN;RANDALL, MICHAEL S.;GRACE, ROY;LAPS, MARK R. 发明人 TAJUDDIN, AZIZUDDIN;RANDALL, MICHAEL S.;GRACE, ROY;LAPS, MARK R.
分类号 H01G9/008 主分类号 H01G9/008
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