发明名称 Object processing method, involves performing chip-removing process of package to process objects from raw material, where each section of raw material produces dimensions similar to objects
摘要 <p>#CMT# #/CMT# The method involves providing sections (1) of a raw material (2) e.g. hard plastic, with same dimensions, and subjecting a main surface of one of the sections to a static friction-increasing pretreatment. The sections are arranged flatly one above the other to a package, in which the main surface of the section lies at a main surface of another section. The package is clamped on a workpiece support. A chip-removing process of the package is performed to process objects from the raw material, where each section of the raw material produces dimensions similar to the objects. #CMT# : #/CMT# An independent claim is also included for a package comprising sections from a plate-shaped raw material. #CMT#USE : #/CMT# Method for processing an object from plate-shaped raw material e.g. light metal and hard plastic (all claimed). #CMT#ADVANTAGE : #/CMT# The package is clamped on the workpiece support, so that the stress is applied on one of the sections contributes to fix the sections in a safe manner. The chip-removing process of the package is performed to process objects from the raw material, where each section of the raw material produces dimensions similar to the objects, thus processing the objects of same dimensions from multi-layer packages of the plate-shaped raw material, without the danger of damages of the objects. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic view illustrating an application of a liquid bonding agent to a section of a plate-shaped raw material. 1 : Sections 2 : Raw material 3 : Liquid bonding agent.</p>
申请公布号 DE102008017690(A1) 申请公布日期 2009.10.15
申请号 DE20081017690 申请日期 2008.04.08
申请人 WISSNER, ROLF 发明人 WISSNER, ROLF
分类号 B23Q3/08;B23Q11/00;B25B11/00 主分类号 B23Q3/08
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