| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and a device for dispersing the stress produced at peeling, reducing the damages given to an electronic component, and stably peeling the electronic component, such as a semiconductor element from an adhesive tape, such as a dicing tape without deteriorating a peeling posture of the electronic component. <P>SOLUTION: The peeling method of the electronic component 101 is provided with a process for bringing a bellowphragm 212 into contact with a second main face which is the other main face of a tape member 121 with the electronic component 101 stuck to a first main face and a process for bringing the bellowphragm 212 into contact with the second main face and supplying fluid to the bellowphragm 212 so as to deform the bellowphragm 212 and the tape member 121 and to peel the electronic component 101 from the tape member 121. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
