发明名称 Biaxially Oriented Film Laminated Board, Electrical Insulation Board and Machine Part
摘要 Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical in sulation, mechanical strength, flexibility and workability can be obtained.
申请公布号 US2009258207(A1) 申请公布日期 2009.10.15
申请号 US20060085552 申请日期 2006.11.21
申请人 TORAY INDUSTRIES, INC.;KAWAMUR SANGYO CO., LTD. 发明人 MIYAJI SHINICHIRO;KOYAMA MAKOTO;YOKURA MIYOSHI
分类号 B32B5/00 主分类号 B32B5/00
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