| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting type die-bonding film suppressing the growth of a void on a boundary between the die-bonding film and an adherend, even in an exposure for a long time at a high temperature, and being capable of improving a reliability on the bonding of the adherend and a semiconductor chip. <P>SOLUTION: A manufacturing method for a semiconductor device at least contains a loading process bonding the semiconductor chip on a die pad for a metallic lead frame laminating a heat-resistant adhesive tape on the outer-pad side and a connecting process electrically connecting the front end of the terminal section of the lead frame and an electrode pad on the semiconductor chip. The manufacturing method for the semiconductor device, at least contains a sealing process one-surface sealing the semiconductor-chip side by a sealing resin and a cutting process cutting a sealed structure into discrete semiconductor device, and in the sealing process, the heat-resistant adhesive tape is peeled and heated, after a heating for a prescribed time. <P>COPYRIGHT: (C)2010,JPO&INPIT |
