发明名称 METHOD OF MANUFACTURING LAMINATED ELECTRONIC PART
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated electronic part by which a variance of thickness of a terminal electrode to upper and lower surfaces of a laminate can be reduced. Ž<P>SOLUTION: In case when a laminated capacitor is manufactured, a green laminate made by stacking a ceramic green sheet and an internal conductor is first prepared. The green laminate is placed on a rigid base, and it is put into a flexible bag and packaged in vacuum. The green laminate is hydrostatically pressed at a first pressure. Then, the green laminate is taken out from the flexible bag, vertically inversed and placed on the rigid base, put into the flexible bag again, and packaged in vacuum. The green laminate is hydrostatically pressed at a second pressure lower than the first pressure. Then, the green laminate is taken out from the flexible bag, and it is cut and baked to form a terminal electrode. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009238914(A) 申请公布日期 2009.10.15
申请号 JP20080081228 申请日期 2008.03.26
申请人 TDK CORP 发明人 SHINKAWA TAKAKI;TAKAGI TOSHI;ANDO NORIHISA;MAEDA SHUDAI
分类号 H01G4/30;H01G4/12;H01G13/00 主分类号 H01G4/30
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