| 发明名称 |
Bonded structures formed by plasma enhanced bonding |
| 摘要 |
An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding the second surface of the substrate and the second surface of the substrate carrier.
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| 申请公布号 |
US2009256882(A1) |
申请公布日期 |
2009.10.15 |
| 申请号 |
US20090488571 |
申请日期 |
2009.06.21 |
| 申请人 |
CHEN CHIEN-HUA;SNYDER BARRY C;HELLEKSON RONALD A |
发明人 |
CHEN CHIEN-HUA;SNYDER BARRY C.;HELLEKSON RONALD A. |
| 分类号 |
B41J2/015;B32B3/00;B32B9/04;B32B15/04;B32B17/06 |
主分类号 |
B41J2/015 |
| 代理机构 |
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