发明名称 A METHOD OF REMOVING A HIGH PRESSURE LAMINATE TOP COVER FROM A COMPOSITE PANEL IN A RAISED FLOOR AND A HEATER PLATE DEVICE THEREOF
摘要 Composite panels form a raised floor. A piece of a composite panel (10) consists of a high pressure laminate top cover (11), an intermediate glue layer (12) and a support floor board (13). According to the present invention, a method of removing the high pressure laminate top cover (11) from the composite panel (10) and a heater plate device (20) are disclosed. The removal method comprises the steps of: Identifying a piece of the composite panel (10) fa a raised floor; placing the heater plate device (20), which matches substantially the shape and size of the composite panel (10), over the composite panel (10); switching on a power source connected to the heater plate device (20) for a predetermined time; and removing the high pressure laminate top cover (11) from the composite panel (10) thereafter. The heater plate device (20) comprises a metallic plate (21) and a non-metallic handle (22). The metallic plate (21) assumes substantially the shape and size of the composite panel (10). The metallic plate (21) is electrically connected to a power source with the assistance of cables or wiring, and a power control box (30), The intermediate glue layer (12) is softened due to heating by the heater pfats device (20) after the power source has been switched on. The high pressure laminate top cover (11) cart then be removed from the composite panel (10) thereafter.
申请公布号 WO2009096771(A3) 申请公布日期 2009.10.15
申请号 WO2009MY00021 申请日期 2009.01.30
申请人 KOW, KEK, HING 发明人 KOW, KEK, HING
分类号 B09B3/00 主分类号 B09B3/00
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