发明名称 |
PATTERN FORMING METHOD, WIRING STRUCTURE, AND ELECTRONIC EQUIPMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern forming method for making an opening part between adjacent patterns finer than resolution of a projection exposing machine and for preventing the occurrence of deviation of dimensional precision between patterns. <P>SOLUTION: The pattern forming method comprises: a step of forming a coating to be etched; a step of forming a plurality of mask patterns on an upper layer of the coating by corresponding to regions being desirable to be left as a plurality of patterns; and a step of forming patterns of the coatings by performing etching treatment by using a plurality of mask patterns as masks. Each of a plurality of mask patterns is formed by the first coating pattern and the second coating pattern having a laminated region in a region in part of the first coating pattern. Width in the transverse direction of the laminated region is the same between adjacent mask patterns in a plurality of different mask patterns. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009237270(A) |
申请公布日期 |
2009.10.15 |
申请号 |
JP20080083222 |
申请日期 |
2008.03.27 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
YAMAYOSHI ICHIJI;NISHIURA ATSUNORI |
分类号 |
G03F7/20;G02F1/13;H01L21/027;H01L21/3213 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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