发明名称 PATTERN FORMING METHOD, WIRING STRUCTURE, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a pattern forming method for making an opening part between adjacent patterns finer than resolution of a projection exposing machine and for preventing the occurrence of deviation of dimensional precision between patterns. <P>SOLUTION: The pattern forming method comprises: a step of forming a coating to be etched; a step of forming a plurality of mask patterns on an upper layer of the coating by corresponding to regions being desirable to be left as a plurality of patterns; and a step of forming patterns of the coatings by performing etching treatment by using a plurality of mask patterns as masks. Each of a plurality of mask patterns is formed by the first coating pattern and the second coating pattern having a laminated region in a region in part of the first coating pattern. Width in the transverse direction of the laminated region is the same between adjacent mask patterns in a plurality of different mask patterns. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009237270(A) 申请公布日期 2009.10.15
申请号 JP20080083222 申请日期 2008.03.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAYOSHI ICHIJI;NISHIURA ATSUNORI
分类号 G03F7/20;G02F1/13;H01L21/027;H01L21/3213 主分类号 G03F7/20
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