发明名称 INDUCTION HEATING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an induction heating device capable of suppressing variations caused in the temperature distribution of a member to be treated since heating or cooling efficiency is high, even when the temperature of the translucent member to be treated is rapidly raised and dropped. Ž<P>SOLUTION: This induction heating device has an induction heating coil 18 formed by a conductive tube member, a first heat insulating member 20 stuck to the induction heating coil 18, a second heat insulating member 22 stuck to the first heat insulating member 20 while having a heat resistant temperature higher than that of the first heat insulating member 20, a graphite 24 stuck to the second heat insulating member 22 and inductively heated based on power fed to the induction heating coil 18, and a separator 26 stuck to the graphite 24 to segregate a process chamber 50 for heat-treating a wafer 30 from a coil chamber 52. The first heat insulating member 20 has a function to reduce temperature differences between one main face and the other main face in the second heat insulating member 22, and a gas layer 29 acting as a thermal medium is interposed between the separator 26 and the wafer 30. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009238375(A) 申请公布日期 2009.10.15
申请号 JP20080078899 申请日期 2008.03.25
申请人 MITSUI ENG & SHIPBUILD CO LTD 发明人 MIYATA JUNYA;INAMI SHOICHI;OZAKI KAZUHIRO;UCHIDA NAOKI
分类号 H05B6/10;H01L21/02;H01L21/31;H05B6/06 主分类号 H05B6/10
代理机构 代理人
主权项
地址