SYSTEM AND METHOD FOR INTEGRATED WAVEGUIDE PACKAGING
摘要
A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.
申请公布号
WO2009102721(A3)
申请公布日期
2009.10.15
申请号
WO2009US33681
申请日期
2009.02.10
申请人
VIASAT, INC.;LOPEZ, NOEL A.;LYONS, MICHAEL R.;LAIDIG, DAVE;BUER, KENNETH V.
发明人
LOPEZ, NOEL A.;LYONS, MICHAEL R.;LAIDIG, DAVE;BUER, KENNETH V.
