| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board that is sufficiently enhanced in substrate strength and reduces a region where mismatching of a coefficient of thermal expansion is caused. <P>SOLUTION: A plurality of terminal pads 27 for mounting an IC chip 31 are provided on a principal surface 12 of a coreless wiring board 10, and a plurality of pads 41A for a PGA and a component mounting pad 41B are provided on the reverse surface 13. On the reverse surface 13 of the coreless wiring board 10, a terminal pin 55 is joined to each pad 41A for the PGA, and a chip capacitor 56 is surface-mounted on the component mounting pad 41B. A reinforcing plate 50 is fixed in surface contact with the reverse surface 13 of the coreless wiring board 10. The reinforcing plate 50 has recesses 52 and 53 wherein a head 58 of the terminal pin 55 and a chip capacitor 56 are disposed. On a bottom surface 52A of the recess 52, an insertion hole 54 is formed into which a shaft portion 57 of the terminal pin 55 is inserted. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
