COPPER-CLAD LAMINATE, METHOD OF MANUFACTURING WIRING BOARD USING THE SAME, END FACE PROCESSING METHOD OF COPPER-CLAD LAMINATE, AND END FACE PROCESSING DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide: a copper-clad laminate capable of preventing cutting waste adhering to an end face formed by cutting from separating from the end face; a method of manufacturing a wiring board using the same; an end face processing method of a copper-clad laminate; and an end face processing device using the same.

SOLUTION: This invention relates to: the copper-clad laminate 10 where an end face E formed by cutting is covered with a protective material 3 formed of a resin; and the method of manufacturing a wiring board using the same. In the end face processing method of a copper-clad laminate, ultraviolet-curable resin paste is cured by an ultraviolet ray while applying the ultraviolet-curable resin paste to an end face E from one end side of the end face E toward the other end side thereof. The end face processing device of a copper-clad laminate includes: a paste application means applying the resin paste while relatively moving from one end side of the end face E toward the other end side; and an ultraviolet emission means arranged adjacent to the paste application means, and emitting an ultraviolet ray while following the paste application means.

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