| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To miniaturize a head substrate by simplifying a pattern. <P>SOLUTION: The head substrate 20 includes a driver IC 30 that selectively drives a plurality of driving elements, external connection terminals 28 for receiving external signal to drive the driver IC 30, and a signal wiring pattern formed so as to obtain conduction between the external connection terminals 28 and the driver IC 30. In a mounting region 31 in the driver IC 30, the first input/output pad array 27 wherein a plurality of pads are formed in an array to be connected with the terminals of the driver IC 30, and the second input/output pad array 29 wherein a plurality of pads which is conducted to the signal wiring pattern and connected with the terminals of the driver IC 30 are formed in an array, are provided on the output side to driving elements. A logic power line 60 and a clock signal line 70 for supplying the clock signal are formed between the first input/output pad array 27 and the second input/output pad array 29. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
