| 摘要 |
PROBLEM TO BE SOLVED: To suppress impedance variation of what is called a resin-made wiring board, formed by stacking at least one conductor layer and resin insulating layer each on at least one principal surface of a core layer, by thinly and uniformly forming the resin insulating layer. SOLUTION: The wiring board has at least one conductor layer and resin insulating layer each stacked on at least the one principal surface of the core layer, and a slit is formed in a plane conductor region provided in a non-wiring region of the conductor layer. COPYRIGHT: (C)2010,JPO&INPIT |
