METHOD FOR FORMING A PRIMING LAYER FOR DEPOSITING A METAL ON A SUBSTRATE
摘要
The invention relates to a method for forming, on a substrate (5), a priming layer enabling a subsequent deposit of a layer of a metal, which comprises immersing the substrate in a bath (7) including a material in the ethoxysilanes or siloxanes families and a copper or nickel amidinate.
申请公布号
WO2009125143(A2)
申请公布日期
2009.10.15
申请号
WO2009FR50524
申请日期
2009.03.30
申请人
STMICROELECTRONICS (TOURS) SAS;CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE;BARRIERE, CLEMENT;FAU, PIERRE;CHAUDRET, BRUNO;MARGEAT, OLIVIER
