发明名称 |
MOLD FOR RESIN INJECTION MOLDING |
摘要 |
<P>PROBLEM TO BE SOLVED: To quickly perform heating and cooling in a mold for resin injection molding. <P>SOLUTION: The mold 1 for resin injection molding comprises a cavity mold 2 and a core mold 3 and is produced on a base plate 31 by metal photofabrication. The cavity mold 2 includes a cavity warm water circuit 23 for allowing warm water for cooling to flow and a cavity cold water circuit 24 for allowing cold water for cooling to flow. The core mold 3 is also provided with a core warm water circuit 33 and a core cold water circuit 34. The core mold 3 comprises an air blowing passage 35 for feeding warm air or cold air into a resin molding part 11 and a suction passage 36 for sucking a gas within the resin molding part 11. The resin molding part 11 side of the air blowing passage 35 and the suction passage 36 is formed of a low-density shaping part 32b that has a low metallic powder sintered density and is permeable to gas. Warm air or cold air can be blown through the low-density shaping part 32b, whereby the rapid heating or cooling of the resin injection mold 1 can be achieved. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009233980(A) |
申请公布日期 |
2009.10.15 |
申请号 |
JP20080082165 |
申请日期 |
2008.03.26 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
AZUMA YOSHIKAZU;ABE SATOSHI;FUWA ISAO;TAKENAMI MASATAKA;YOSHIDA TOKUO |
分类号 |
B29C33/38;B29C45/26;B29C45/73 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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