发明名称 POSITIONING DEVICE AND CONTROLLING METHOD OF POSITIONING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a positioning device capable of obtaining a high performance and high yield material to be processed by accurately positioning the processing position of a processing apparatus based on the measured positioning information of a surface to be processed of the material to be processed. SOLUTION: The positioning device includes control parts (23, 26, 27, 28, 29) for controlling a main-scanning shaft 3 and sub-scanning shaft 10 so that the processing position of the inkjet head 4 is brought to the target position by a correction action which moves the processing position of an inkjet head 4 to the sub-scanning direction relative to the surface to be processed by the sub-scanning shaft 10, when the processing position of the inkjet head 4 is moved to the main-scanning direction toward a target position on the surface to be processed on a substrate 1 by the main-scanning shaft 3, and if the target position is shifted to the sub-scanning direction based on the position of the site to be processed on the surface to be processed of the substrate 1 stored in a substrate position memory part 25. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009239155(A) 申请公布日期 2009.10.15
申请号 JP20080085758 申请日期 2008.03.28
申请人 SHARP CORP 发明人 IWATA YUTAKA
分类号 H01L21/68;B05C5/00;B05C11/00;H01L21/027 主分类号 H01L21/68
代理机构 代理人
主权项
地址