| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element which is mounted in high yield without having an end surface damaged even when mounted by multi-chip mounting technique. SOLUTION: The semiconductor element 15 has an end surface protective thin film 1 formed in such a manner that it protrudes from an end surface 7, and is mounted in such a manner that the end surface protective film 1 is held between the end surface and the opposite surface of an opposite-side element to be made to abut. The end surface protective thin film 1 serves as a cushion during the mounting, so the end surface 7 (especially, a peripheral region of a core layer 17) of the semiconductor element 15 is not mechanically damaged to avoid the deterioration of the semiconductor element 15. The end surface protective thin film 1 is located at a position where light made incident and projected from the end surface 7 of the semiconductor element 15 is not blocked and it is made sufficiently thin, for example, about 0.5μm thick, so that efficiency of optical coupling between the semiconductor element 15 and opposite-side element is held high. COPYRIGHT: (C)2010,JPO&INPIT |
