| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a heat sink which dissipates heat generated by a semiconductor chip to the outside, wherein the heat sink is prevented from peeling and a void is prevented from being formed in a mold resin sealing the heat sink. <P>SOLUTION: The semiconductor device 1 includes the heat sink 3 formed in a plate shape, the semiconductor chip 7 fixed to the side of a top surface 3a thereof, and a mold resin 9 sealing the heat sink 3 and semiconductor chip 7 so that a reverse surface 3b of the heat sink 3 is exposed. On a portion of a side surface 35a of the heat sink which is covered with the mold resin 9, a projection 37 extending from the side surface 35a along the top surface 3a is formed forming steps with the top surface 3a and reverse surface 3b of the heat sink 3. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
