发明名称 THERMAL ADHESIVE SHEET AND KEY SHEET
摘要 PROBLEM TO BE SOLVED: To provide a thermal adhesive sheet with which positioning in bonding is easily conducted, which has excellent punching workability and high adhesion strength. SOLUTION: The thermal adhesive sheet comprises releasable films disposed on each surface of a double-sided adhesive sheet having heat-sensitive adhesive layer surfaces composed of a thermoplastic adhesive on both surfaces of it. In the thermal adhesive sheet, releasing force between one surface of the double-sided adhesive sheet and the releasable film and that between the other surface of the double-sided adhesive sheet and the releasable film are mutually different, a ratio of releasing force (F<SB>1</SB>) of the easy-to-release side requiring less releasing force to releasing force (F<SB>2</SB>) of the hard-to-release side requiring more releasing force is represented by (F<SB>2</SB>/F<SB>1</SB>)>1, an elastic modulus E' of the heat-sensitive adhesive layer on the easy-to-release side at 23°C in a dynamic viscoelasticity spectrum with a frequency of 1 Hz is 10<SP>4</SP>-10<SP>9</SP>Pa, the releasable film of the easy-to-release side is composed of a mold release-processed resin film, and wet tension of the resin film is 35 mN/m or less. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009235319(A) 申请公布日期 2009.10.15
申请号 JP20080086283 申请日期 2008.03.28
申请人 DIC CORP 发明人 YAMAGAMI AKIRA;TAKEI HIDEAKI
分类号 C09J7/02;C09J167/00;H01H13/14 主分类号 C09J7/02
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