POWDERY Pb-Sn SOLDER ALLOY FOR PASTE, AND Pb-Sn SOLDER ALLOY BALL

摘要

<P>PROBLEM TO BE SOLVED: To provide a powdery Pb-Sn solder alloy for a solder paste and a Pb-Sn solder alloy ball, which are used to form a bump that has a small number of voids and dents generated, and to provide a solder paste containing the powdery Pb-Sn solder alloy. Ž<P>SOLUTION: Each of the powdery Pb-Sn solder alloy and the Pb-Sn solder alloy ball contains 1-65 mass% Sn and the balance Pb with inevitable impurities. The content of Ni contained as the above inevitable impurity is ≤2 ppm. Further, a paste containing the above powdery Pb-Sn solder alloy is provided. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž