| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component and a mounting structure of the electronic component, for achieving excellent bonding by conductive paste while suppressing the enlargement of the electronic component. Ž<P>SOLUTION: For a common mode filter, a flange part 11 of a drum core constituted of a magnetic body such as ferrite or a non-magnetic body such as ceramic is provided with an electrode 40. When fitting the electrode 40 which is a roughly U-shaped metal fitting to the flange part 11, a gap for the conductive paste P to be interposed between a facing surface 41B and a facing surface 11H is formed. When mounting the common mode filter on the electrode pattern 2A of a circuit board 2, the conductive paste P bonds the common mode filter 1 and the circuit board 2 in the state with both interposed integrally from the part between the exposed region 11F of a mounting surface and the mounting surface 41A of the electrode 40 to the part between the facing surface 41B of the electrode 40 and the facing surface 11H of the flange part 11. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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