发明名称 MARKING FILM
摘要 PROBLEM TO BE SOLVED: To provide a marking film which is superior in curved surface followability in a relatively low temperature environment and can suppress bubble entrainment between it and an adherend during sticking. SOLUTION: The marking film 1, which is stuck on the adherend to be used, has a substrate 11 and a pressure sensitive adhesive layer 12 formed on the substrate 11. The substrate 11 has a Young's modulus at 5°C of 600-1,300 MPa and a storage modulus at 5°C of 900-2,000 Pa. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009234012(A) 申请公布日期 2009.10.15
申请号 JP20080082846 申请日期 2008.03.27
申请人 LINTEC CORP 发明人 TETSUNA ATSUSHI
分类号 B32B27/00;C09J7/02;C09J201/00;G09F3/02;G09F3/10 主分类号 B32B27/00
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