| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which transmission loss is improved in a transmission line for transmitting a signal of high-frequency band. Ž<P>SOLUTION: Conductive paste is embedded in a conductive paste filling portions (CHs), formed by opening a cover layer 30 on a ground line 21 to form a conduction portion 41 for conductively connecting the ground line 21 to a metal layer 40, and a metal film 42, having 10 μm or smaller film thickness and containing a silver nanopaste of low volume resistance rate is formed on the metal layer 40. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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