发明名称 |
SEMICONDUCTOR PACKAGING TECHNIQUES |
摘要 |
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die. |
申请公布号 |
US2009256246(A1) |
申请公布日期 |
2009.10.15 |
申请号 |
US20090487666 |
申请日期 |
2009.06.19 |
申请人 |
VISHAY-SILICONIX |
发明人 |
CHANG MIKE;OWYANG KING;HO YUEH-SE;KASEM Y. MOHAMMED;LUO LIXIONG;CHU WEI-BING |
分类号 |
H01L23/495;H01L21/50;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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