| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device that eliminates the need for high accuracy of finishing and has an excellent solder fillet formed, and is reducible in height. <P>SOLUTION: The resin sealed semiconductor device 10 includes a semiconductor chip 1, a plate type connector 5 having one end connected to a top surface of the semiconductor chip 1, a lead 3 where the other end of the connector is connected to one end 31 using solder 4, and a sealing portion 6 sealing them such that the other end of the lead 3 is exposed. The lead has a recess 32 at the one end 31, the connector 5 has the other end formed in a bent shape, and a projection end thereof is engaged with the recess 32. <P>COPYRIGHT: (C)2010,JPO&INPIT |
