STRUCTURE OF BUMP ELECTRODE, ELEMENT MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND PORTABLE EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a connection between a bump structure and an electrode of a semiconductor element in a structure wherein the bump structure and the electrode of the semiconductor element are connected to each other.

SOLUTION: Disclosed is the structure of the bump electrode 16 which is electrically connected to a wiring layer 14 constituting the element mounting board 10, and projects from the wiring layer 14. The structure of the bump electrode 16 is provided with a binding portion 22 within a predetermined range of a side surface of the bump electrode 16.

COPYRIGHT: (C)2010,JPO&INPIT