| 摘要 |
PROBLEM TO BE SOLVED: To provide a designing method that suppresses warpageof a multilayer wiring substrate. SOLUTION: At each of layers of the multilayer wiring substrate, a metal interconnect for power supply or grounding needs a conductor surface (metal plane) of a large area for suppressing noises, and the like. A space portion (resin insulator) between such metal planes has a relatively low elastic modulus compared to the metal plane, thus causing a warpage, when subjected to heat treatment, and the like. In order to cope with this, space portions are shifted to each other between a plurality of layers so that the spaces do not overlap in angles, and the positions or a reinforcing metal plane is disposed on a signal line layer, above or below the space portion to increase resistance against warping, or alternatively, the disposition and angle of the signal line layer is adjusted by increasing the resistance with respect to warpages. COPYRIGHT: (C)2010,JPO&INPIT |
