| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure of substrates in which stress generated owing to a shift between an element substrate and a mounting substrate is mitigated and a product having the element substrate mounted on the mounting substrate is made thin. Ž<P>SOLUTION: The connection structure A1 of substrates for mounting the element substrate 10 having an electronic element 11 arranged on a top surface, on the mounting substrate 20, includes a fixed portion 31 which is connected to the electronic element 11 and fixed to the element substrate 10, a mounting portion 32 soldered to the mounting substrate 20, and an elastic portion 33 which connects the fixed portion 31 and mounting portion 32 to each other and elastically deforms. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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