发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 According to an aspect of the present invention, there is provided a semiconductor device including: a semiconductor substrate; active areas with island-like shapes formed on the semiconductor substrate; an element isolation area surrounding the active areas and including an element isolation groove formed on the semiconductor substrate and an element isolation film embedded into the element isolation groove; gate insulating films each formed on corresponding one of the active areas and having a first end portion that overhangs from the corresponding active area onto the element isolation area at one side and a second end portion that overhangs from the corresponding active area onto the element isolation area at the other side, wherein an overhang of the first end portion has a different length from a length of an overhang of the second end portion.
申请公布号 US2009256190(A1) 申请公布日期 2009.10.15
申请号 US20090420363 申请日期 2009.04.08
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SUZUKI ATSUHIRO;SHIMODE HIROSHI;SHIMANE TAKESHI;ARAI NORIHISA;KAJIMOTO MINORI
分类号 H01L29/788;H01L21/336;H01L21/76 主分类号 H01L29/788
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