发明名称 HEAT EQUALIZER AND ORGANIC FILM FORMING APPARATUS
摘要 <p>A heat equalizer comprising a container structure with a heating block (1) capable of heating a material to be heated and vaporizing the same, filled thereinside with a working fluid; heating means (6) disposed on the bottom of the container structure; and a material supply pipe (11) realizing communication between the outside and the inside of the container structure. The heating block (1) is provided with a main header pipe (12) as a flow channel for flow of the material to be heated that is connected to the material supply pipe (11) and extends in a horizontal direction and with a riser pipe (14) branched from the main header pipe (12) and extending in a vertical direction. Further, the heating block is provided with a condensation hole (10) as a condensation channel for cooling and condensation of the working fluid that lies on both sides of the riser pipe (14) and extends in a horizontal direction and with a condensation pit (16) lying on the underside of the riser pipe (14). The main header pipe (12) is disposed between the condensation hole (10) and the condensation pit (16).</p>
申请公布号 WO2009125497(A1) 申请公布日期 2009.10.15
申请号 WO2008JP57205 申请日期 2008.04.11
申请人 NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY;TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION;OHMI, TADAHIRO;KITANO, MASAFUMI;YAMAKAGE, HISAAKI;YAMADA, YOSHIHITO 发明人 OHMI, TADAHIRO;KITANO, MASAFUMI;YAMAKAGE, HISAAKI;YAMADA, YOSHIHITO
分类号 C23C14/24;C23C14/12 主分类号 C23C14/24
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