| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure which has excellent coplanarity and is high in yield and also stacked into an inexpensive package stack type, and to provide an inexpensive electronic apparatus which is enhanced in function and made compact by applying the mounting structure. <P>SOLUTION: The mounting structure 60 is constituted by fusing and connecting solder bumps 5 on a reverse surface of a semiconductor device 50 to electrodes of a flexible wiring board 7, bonding and fixing part of a side face of the semiconductor device 50 and a part of a top surface thereof such that the semiconductor device 50 is wrapped with the flexible wiring board 7, and forming electrodes on the top surface of the semiconductor device 50. The mounting structure 60 is constituted including a support body 90 at least partially between the reverse surface or side face of the semiconductor device 50 and the flexible wiring board 7. <P>COPYRIGHT: (C)2010,JPO&INPIT |
