| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure which has excellent coplanarity and is high in yield and also stacked into an inexpensive package stack type, and to provide an inexpensive electronic apparatus which is enhanced in function and made compact by applying the mounting structure. <P>SOLUTION: The mounting structure 60 has a support body 9 formed by fusing and connecting solder bumps 5 on a reverse surface of a semiconductor package 50 to electrodes of a flexible wiring board 7 and wrapping a side face of the semiconductor package 50 and the opposite surface from its external terminal formation surface, and having projection portions 9a, wherein part of a side face of the support body 9 and part of the top surface are bonded and fixed to be wrapped with the flexible wiring board 7, and electrodes are formed on the top surface of the semiconductor package 50. <P>COPYRIGHT: (C)2010,JPO&INPIT |
