发明名称 OPTICAL INTEGRATED CIRCUIT MODULE, OPTICAL BENCH USED FOR OPTICAL INTEGRATED CIRCUIT MODULE AND METHOD OF MANUFACTURING OPTICAL INTEGRATED CIRCUIT MODULE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an optical integrated circuit module of which the yield is improved, an optical bench used for the module and a method of manufacturing the optical integrated circuit module. <P>SOLUTION: The optical integrated circuit module 1 is manufactured by optically connecting a plurality of semiconductor waveguides 8 of an LD array 2 and a plurality of optical waveguides 9 of a plane optical wave circuit 5 by abutting the end face 4 of an SOB (silicon optical bench) 3 as an optical bench on which the LD array 2 is mounted and the end face 7 of a PLC 6 as an optical waveguide element on which the plane optical wave circuit 5 is formed. In the optical integrated circuit module 1, the end face 4 of the SOB 3 is polished to a surface roughness smaller than the surface roughness cut with a dicer. Namely, by finishing by polishing the end face 4 of the SOB 3, the positional accuracy of the end face 4 is enhanced and the errorΔZ of the end face distance Z is reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009237326(A) 申请公布日期 2009.10.15
申请号 JP20080084061 申请日期 2008.03.27
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 AKUTSU TAKASHI;NARA KAZUTAKA;HASEGAWA JUNICHI
分类号 G02B6/13;G02B6/42;H01S5/022 主分类号 G02B6/13
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