| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide electronic equipment that secure a creepage distance between a land of a printed wiring board mounting with an insertion mounted type power element without lead forming of the insertion mounted type power element, and a heat dissipation member. <P>SOLUTION: The insertion mounted type power element 20 has leads 22, extending linearly from a main portion 21 containing a semiconductor chip, inserted into through-holes 12 of a printed wiring board 10 and also soldered to lands 13. A heat sink 30 is fixed on the printed wiring board 10 by screwing a screw Sc1 penetrating the printed wiring board 10, and thermally coupled to the insertion mounted type power element 20 by screwing a screw penetrating the main portion 21 of the insertion mounted type power element 20. A hollow 35 is formed at a position which is at least a contact portion 30a of the heat sink 30 for the printed wiring board 10, and also opposed to the land 13. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
