| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board where a high-density structure with high heat dissipation properties is formed and a surface-layer circuit is formed with high precision by reducing variations in thickness of copper of a surface layer while forming a copper plating thick enough to secure the high heat dissipation properties in a through-hole and forming a filled via filled with a copper plating in a non-through-hole. <P>SOLUTION: The printed circuit board 1 has the surface-layer circuit 22, an internal-layer circuit 16, and both the non-through-hole 17 and through-hole 15 as inter-layer connection holes therefor, in which the electroless copper plating 19 and electric copper plating 24 are both formed. The non-through-hole 17 is filled with both the platings, and the through-hole 15 has the electroless copper plating 19 formed as thick as or thicker than the electric copper plating 24. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
