| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat sink with improved heat dissipation effects. <P>SOLUTION: The heat sink 61 mounted on a heating element such as a highly exothermic semiconductor device 1 for dissipating heat of the heating element includes a metallic plate 62 serving as a pressure-welded member to be pressure-welded to the element and a heat dissipating fin 66 formed to be folded in multiple rows, having a top face 63 including a notch 64 at its center and having a bottom face opposite to the top face 63 joined with the metallic plate 62. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
