发明名称 |
LIQUID THERMOSETTING RESIN COMPOSITION, PREPREG AND METAL-CLAD LAMINATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition using a cyclic phenoxyphosphazene compound excellent in varnish stability as a flame retardant, and to provide a prepreg and a copper-clad laminate. Ž<P>SOLUTION: A thermosetting resin composition is used containing, as a flame retardant, a cyclic phenoxyphosphazene compound which is substituted by a group selected from a substituent represented by formula (II), cyanic ester-substituted phenoxide and methyl-substituted phenoxide and which is liquid at ordinary temperature. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2009235123(A) |
申请公布日期 |
2009.10.15 |
申请号 |
JP20080079145 |
申请日期 |
2008.03.25 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
INOUE HIROHARU;KASHIWABARA KEIKO;UNO MINORU;ISHIKAWA TOMOYUKI;ABE TAKATOSHI |
分类号 |
C08K5/5399;B32B15/08;B32B15/14;C08J5/24;C08L85/02;C08L101/00;C09K21/12 |
主分类号 |
C08K5/5399 |
代理机构 |
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主权项 |
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地址 |
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