| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing die-bonding tape wherein a semiconductor wafer and a die-bonding film are precisely cut by laser dicing, and after the laser dicing, a semiconductor chip is easily released together with the die-bonding film. Ž<P>SOLUTION: The dicing die-bonding tape for laser dicing includes a die-bonding film 3 and a non-adhesive film 4 pasted on one side 3a of the die-bonding film 3. The die-bonding film 3 contains a thermosetting compound and thermosetting agent. The non-adhesive film 4 contains resin bridging substance as a main component. The dicing die-bonding tape has the storage elasticity at 25°C of 1-1,000 MPa, and that at 60°C of 1 MPa or higher. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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