发明名称 THERMOPLASTIC ELASTOMER COMPOSITION AND SEALING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermoplastic elastomer composition that scarcely causes the contamination and corrosion on an electronic device and in addition is served as a material for a sealing material having sufficient recyclability. Ž<P>SOLUTION: The thermoplastic elastomer composition is used in an electronic device and is produced by subjecting a raw material composition comprising (A) an ethylene-α-olefin-based copolymer rubber having a chlorine content of not more than 60 ppm as measured by X-ray fluorescence spectrometry and (B) at least one kind of thermoplastic resin selected from the group consisting of an α-olefin-based crystalline thermoplastic resin, an α-olefin-based amorphous thermoplastic resin and a cycloolefin-based thermoplastic resin, to a dynamic heat treatment, (C) in the presence of a crosslinking agent. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009235192(A) 申请公布日期 2009.10.15
申请号 JP20080081388 申请日期 2008.03.26
申请人 JSR CORP 发明人 MORIOKA SEIJI;KANAE KENTARO;TANAKA MINORU;KAI DAISUKE
分类号 C08L23/00;C08J3/24;C09K3/10 主分类号 C08L23/00
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