发明名称 LAMINATED BODY, CIRCUIT BOARD INCLUDING LAMINATED BODY, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING LAMINATED BODY
摘要 <p>A laminated body includes a first resin layer composed of a first fiber base material and a resin, and a second resin layer composed of a second fiber base material and a resin. The first and the second resin layers are arranged so that at least parts of the resin layers position in different regions, respectively, by having a center line in the thickness direction of the laminated body in between. At least the first fiber base material or the second fiber base material has a bent texture region, i.e., a region where a smaller cross angle formed by the warp and the weft of the fiber base material is less than 90°A larger angle of the angles, which are an angle formed by the first fiber base material and the warp of the second fiber base material and an angle formed by the first fiber base material and the waft of the second fiber base material, is 2°or less.</p>
申请公布号 KR20090108636(A) 申请公布日期 2009.10.15
申请号 KR20097017331 申请日期 2008.02.07
申请人 发明人
分类号 B32B5/10 主分类号 B32B5/10
代理机构 代理人
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