发明名称 WIRING SUBSTRATE, SOLID IMAGING APPARATUS, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid imaging apparatus capable of reducing position shift of a lens unit on a wiring substrate. <P>SOLUTION: In a solid imaging apparatus 100, a portion of a solid imaging element 2 is exposed from an opening formed on a wiring substrate 1. A projection 32a formed on a lens unit 3 is inserted into the opening, and contacts with a side surface of the solid imaging element 2. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009239636(A) 申请公布日期 2009.10.15
申请号 JP20080083370 申请日期 2008.03.27
申请人 SHARP CORP 发明人 NAKAMURA MASAO
分类号 H04N5/225;H01L27/14;H04N5/335;H04N5/372;H04N5/374 主分类号 H04N5/225
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