| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing exfoliation of wire bonding due to needle marks formed during a probe test with a smaller pad area, in particular, a smaller area in the vertical direction with respect to the row of pads. <P>SOLUTION: The semiconductor device includes first and second pads P1 and P2 arranged along a first direction. The length of the side of the first pad P1 along the first direction is longer than the length of the side of the second pad P2 along the first direction. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
