| 摘要 |
PROBLEM TO BE SOLVED: To lower producing cost of a wafer processing apparatus by reducing the number of transfer devices. SOLUTION: The wafer processing apparatus 10 for processing a wafer 20 in which a front surface protecting film 110 is attached to the front surface where a circuit pattern is formed is provided with a dicing tape attaching unit 30 for integrating a mount frame and a wafer by attaching a dicing tape 3 to the mount frame 36 and the rear surface of the wafer and a front surface protecting film peeling unit 50 for peeling the front surface protecting film from the front surface of the wafer using a peeling tape 4. Moreover, the wafer processing apparatus includes a multi-joint robot 60 for executing at least any one of transfer of the wafer integrated with the mount frame in the dicing tape attaching unit to the front surface protection film peeling unit through inversion thereof and transfer of the wafer from which the front surface protection film is peeled in the front surface protection film peeling unit to the wafer accommodating place. COPYRIGHT: (C)2010,JPO&INPIT |
