发明名称 |
ELECTRONIC CIRCUIT MODULE AND PROJECTOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a technique for improving heat radiation efficiency in an electronic circuit module equipped with heat-generating components. SOLUTION: The electronic circuit module having heat-generating components and utilizing an air blow to radiate heat of the heat-generating components includes: a planar heat-radiating plate disposed so as to abut on the heat-generating components and radiate heat of the heat-radiating components; an opposite surface facing a heat-radiating plate opposite to an opposite surface of a surface abutting on the heat-generating components; and a protruding portion disposed between the heat-generating plate and the opposite surface to increase the flow rate of an air blow therebetween in the peripheral portion. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009238785(A) |
申请公布日期 |
2009.10.15 |
申请号 |
JP20080079170 |
申请日期 |
2008.03.25 |
申请人 |
SEIKO EPSON CORP |
发明人 |
SHIOIRI KENICHI;ABE TAKUYA |
分类号 |
H01L23/467;G03B21/16;H02M3/28;H05K7/20 |
主分类号 |
H01L23/467 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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